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TPS56100 Datasheet(PDF) 26 Page - Texas Instruments |
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TPS56100 Datasheet(HTML) 26 Page - Texas Instruments |
26 / 27 page TPS56100 HIGH-EFFICIENCY DSP POWER SUPPLY CONTROLLER FOR 5-V INPUT SYSTEMS SLVS201A – JUNE 1999 – REVISED JULY 1999 26 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA PWP (R-PDSO-G**) PowerPAD ™ PLASTIC SMALL-OUTLINE PACKAGE 4073225/E 03/97 0,50 0,75 0,25 0,15 NOM Thermal Pad (See Note D) Gage Plane 28 24 7,70 7,90 20 6,40 6,60 9,60 9,80 6,60 6,20 11 0,19 4,50 4,30 10 0,15 20 A 1 0,30 1,20 MAX 16 14 5,10 4,90 PINS ** 4,90 5,10 DIM A MIN A MAX 0,05 Seating Plane 0,65 0,10 M 0,10 0 °–8° 20-PIN SHOWN NOTES: B. All linear dimensions are in millimeters. C. This drawing is subject to change without notice. D. Body dimensions do not include mold flash or protrusions. E. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. F. Falls within JEDEC MO-153 PowerPAD is a trademark of Texas Instruments Incorporated. |
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