TPS3305-18, TPS3305-25, TPS3305-33

DUAL PROCESSOR SUPERVISORS

SLVS198 – DECEMBER 1998

5

POST OFFICE BOX 655303

TPS3305Y chip information

These chips, when properly assembled, display characteristics similar to those of the TPS3305. Thermal

compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be

mounted with conductive epoxy or a gold-silicon preform.

56

48

TPS3305Y

(1)

(2)

(3)

(5)

(6)

CHIP THICKNESS: 10 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS

(4)

(7)

(8)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

I/O

DESCRIPTION

GND

4

Ground

MR

7

I

Manual reset

RESET

5

O

Active-low reset output

RESET

6

O

Active-high reset output

SENSE1

1

I

Sense voltage input 1

SENSE2

2

I

Sense voltage input 2

WDI

3

I

Watchdog timer input

VDD

8

Supply voltage