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ASM3P2107A Datasheet(PDF) 2 Page - PulseCore Semiconductor

Part No. ASM3P2107A
Description  Peak EMI Reducing Solution
Download  7 Pages
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Manufacturer  PULSECORE [PulseCore Semiconductor]
Direct Link  http://www.onsemi.com/
Logo PULSECORE - PulseCore Semiconductor

ASM3P2107A Datasheet(HTML) 2 Page - PulseCore Semiconductor

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November 2006
ASM3P2107A
rev 0.4
Peak EMI Reducing Solution
2 of 7
Notice: The information in this document is subject to change without notice.
CLOCKOUT
1
2
3
4
5
6
7
8
ASM3P2107A
XIN / CLKIN
XOUT
GND
NC
VDD
NC
NC
Pin Configuration
Pin Description
Pin#
Pin Name
Type
Description
1
XIN/CLKIN
I
Crystal connection or external reference frequency input. This pin has dual functions. It
can be connected to either an external crystal or an external reference clock.
2
XOUT
O
Crystal connection. If using an external reference, this pin must be left unconnected.
3
GND
P
Ground to entire chip.
4
NC
-
No connect.
5
CLOCKOUT
O
Spread spectrum low EMI output.
6
VDD
P
Power supply for the entire chip (5V).
7
NC
-
No connect.
8
NC
-
No connect.
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VDD, VIN
Voltage on any pin with respect to Ground
-0.5 to +7.0
V
TSTG
Storage temperature
-65 to +125
°C
TA
Operating temperature
0 to 70
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
TDV
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
2
KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.


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