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CHP2-100-1001-F-BLK-LF Datasheet(PDF) 1 Page - IRC - a TT electronics Company. |
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CHP2-100-1001-F-BLK-LF Datasheet(HTML) 1 Page - IRC - a TT electronics Company. |
1 / 3 page General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA © IRC Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal Glaze™ thick film element fired at 1000°C to solid ceramic substrate High temperature dielectric coating Solder over nickel barrier Metal Glaze™ Cylindrical Surface Mount Power Resistors Electrical Data CHP Series • Up to 2 watts • Up to 1000 volts • 0.2 ohm to 2.2 megohm range • RoHS-compliant version available • 150°C maximum operating temperature Environmental Data IRC Type Indus- try Foot- print Size Code1 Maximum Power Rating Working Voltage² Maximum Voltage Resistance Range (ohms)³ Product Category Tolerance (±%)³ TCR (ppm/°C)³ CHP 1/8 1206 B & C 1/4W @ 70°C 200 400 0.1 to 0.99 Low Range 1, 2, 5 100 1.0 to 1.0 M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 CHP 1/2 2010 D & E 1/2W @ 70°C 300 600 0.1 to 0.99 Low Range 1, 2, 5 100 1.0 to 348K Standard 1, 2, 5 50, 100 CHP 1 2512 F 1W @ 70°C 350 700 0.1 to 0.99 Low Range 1, 2, 5 100 1.0 to 2.21M Standard 1, 2, 5 50, 100 20 to 348K Tight Tolerance 0.25, 0.5 50, 100 CHP 2 3610 H 2W @ 25°C 1.33W @ 70°C 500 1000 0.2 to 0.99 Low Range 1, 2, 5 100 1.0 to 2.21M Standard 1, 2, 5 50, 100 ¹See page 8 for product dimensions, recommended solder pads, and standard packaging. ²Not to exceed P x R ³Consult factory for tighter TCR, tolerance, or resistance values. √ Characteristics Maximum Change Test Method Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C) Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles) Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% + 0.01 ohm ±1% for R>100K ohm MIL-R-55342E Par 4.7.5 2.5 x for 5 seconds High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (-150°C for 100 hours) Resistance to Bonding ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds) Exposure 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Solderability ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent) Life Test Terminal Adhesion Strength ±1% + 0.01 ohm no mechanical damage 1200 gram push from underside of mounted cchip for 60 seconds ±1% + 0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, deflected 1mm so as to exert pull on chip contacts for 5 seconds √ CHP Series Issue July 2009 Sheet 1 of 3 |
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