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DIP-4761HT-02-1001JF Datasheet(PDF) 1 Page - IRC - a TT electronics Company.

Part # DIP-4761HT-02-1001JF
Description  TaNFilm짰 High Temperature DIP and SIP Networks
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Manufacturer  IRCTT [IRC - a TT electronics Company.]
Direct Link  http://www.irctt.com
Logo IRCTT - IRC - a TT electronics Company.

DIP-4761HT-02-1001JF Datasheet(HTML) 1 Page - IRC - a TT electronics Company.

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General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
· Inherent reliability
· Custom configurations available
· Bonded leads not susceptible to solder reflow problems
· Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
· Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C
1900HT / 4700HT SERIES
IRC Advanced Film Division
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low
profile, TaNFilm® DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics
of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
Electrical Data
TaNFilm® High Temperature
DIP and SIP Networks
Package
Type
Size
Schematic
Ohmic
Range
Package
Power
Element
Power
Rated Voltage
(not to exceed
rated power)
Temperature
Range
DIP
14
Isolated
Schematic A
100Ω to 100KΩ
1.12W
0.08W
100V
-55°C to +200°C
Bussed
Schematic B
1.00KΩ to 50KΩ
16
Isolated
Schematic A
100Ω to 100KΩ
1.28W
Bussed
Schematic B
1.00KΩ to 50KΩ
SIP
6
Isolated
Schematic G
50Ω to 50KΩ
0.24W
0.08W
50V
Bussed
Schematic C
2.00KΩ to 25KΩ
8
Isolated
Schematic G
50Ω to 50KΩ
0.32W
Bussed
Schematic C
2.00KΩ to 25KΩ
Sputtered tantalum
nitride with passivation
oxide layer
Thermo-compression
bonded leads provide
exceptional reliability
Ceramic sandwich construction with
high temperature epoxy encapsulent
HT Series Issue November 2008 Sheet 1 of 3


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