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TLV2217 Datasheet(PDF) 2 Page - Texas Instruments |
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TLV2217 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 6 page  TLV2217 LOW DROPOUT FIXEDVOLTAGE REGULATORS SLVS067K − MARCH 1992 − REVISED AUGUST 2004 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description/ordering information (continued) The TLV2217 family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum continuous input voltage of 16 V, making them more versatile than CMOS regulators. Utilizing a pnp pass element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of 500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the TLV2217 regulators offer very tight output accuracy of ±2% across operating load and temperature ranges. Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection, and overvoltage protection. The TLV2217 family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and 3.3 V. absolute maximum ratings over operating virtual junction temperature range (unless otherwise noted)† Continuous input voltage, VI 16 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package thermal data (see Note 1) PACKAGE BOARD θJP* θJC θJA PowerFLEX /TO-252 (KTP) High K, JESD 51-5 3 °C/W 28 °C/W TO-220 (KC/KCS) High K, JESD 51-5 3 °C/W 19 °C/W TSSOP (PW) High K, JESD 51-7 32 °C/W 83 °C/W *For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. recommended operating conditions MIN MAX UNIT VI Input voltage 3.0 12 V IO Output current 0 500 mA TJ Operating virtual junction temperature range 0 125 °C ‡ Minimum VI is equal to 3.0 V or VO(max) + 0.6 V, whichever is greater. |
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