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45830-2223 Datasheet(PDF) 1 Page - Molex Electronics Ltd. |
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45830-2223 Datasheet(HTML) 1 Page - Molex Electronics Ltd. |
1 / 2 page FEATURES AND SPECIFICATIONS 1.20 by 2.00mm (.047 by .079”) Pitch HD Mezz™ Connectors 45802 HD Mezz™ Receptacle 45830 HD Mezz™ Plug SPECIFICATIONS n Molex’s patented solder attach method is more cost effective and reliable than Ball Grid Array (BGA) connector attach methods n Data rates up to 12.5 Gbps for excellent signal clarity with ample bandwidth for customer requirements in high-speed designs n Stack heights ranging from 16.00 to 38.00mm (.630 to 1.496”) and circuit sizes of 91 to 403 circuits provides ease in design based on engineering constraints in system envelopes n Highest contact density on the market with 14 differential pairs per cm2 is extremely useful for space constrained designs with limited PCB real estate n Reliable mating interface with 2.00mm (.079”) wipe and two points of contact with sufficient conductive wipe for clean signal transmission and enhanced durability Features and Benefits The High Density Mezzanine (HD Mezz) board-to- board connector is designed for computer, networking, telecommunications, storage and general market applications with high pin-count devices on mezzanine or module printed circuit boards (PCBs). This design provides a flexible tooling approach that allows for multiple stack heights and circuit-size extensions. HD Mezz provides many benefits. It allows customers to simplify PCB routing without sacrificing performance, avoid the expense of large complex multi-layer boards and utilize space more efficiently within a given card slot area. Option cards may be added or upgraded to increase flexibility in design, production and testing. The HD Mezz design has superior electrical and mechanical features that are cost competitive. The Molex patented solder-charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products. Reference Information Product Specification: PS-45802-001 Packaging: Tray UL File No.: TBD CSA File No.: TBD Designed in: Millimeters Electrical Voltage: 250V AC per contact Current: 2.0A per contact Contact Resistance: 25 milliohms nominal Dielectric Withstanding Voltage: 500V DC Insulation Resistance: Across Wafers – 5000 Megohms min. Within Wafers – 1000 Megohms min. Mechanical Mating Force: 51g nominal per contact Unmating Force: 25g nominal per contact Normal Force: 51g nominal per contact Durability: 100 cycles Physical Housing: Glass-filled LCP, UL 94V-0 Contact: Copper (Cu) alloy Plating: Contact Area – 0.75µm Gold (Au) min. Solder Tail Area – 2.50µm Tin (Sn) min.* Underplating – 1.25µm Nickel (Ni) overall Operating Temperature: -55 to +105°C Simplify PCB routing, maximize card-slot space and achieve speeds up to 12.5 Gbps with Molex’s HD Mezz; designed for the large and growing high-density and high-performance mezzanine connector market Left to right: HD Mezz Receptacle (Series 45802) and HD Mezz Plug (Series 45830) *Please contact Molex Customer Service for lead-free solder tail plating options |
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