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TMS3473BDW Datasheet(PDF) 1 Page - Texas Instruments |
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TMS3473BDW Datasheet(HTML) 1 Page - Texas Instruments |
1 / 13 page TC211 192- × 165-PIXEL CCD IMAGE SENSOR SOCS008B – JANUARY 1990 Copyright © 1990, Texas Instruments Incorporated 2-1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 • Full-Frame Operation • Antiblooming Capability • Single-Phase Clocking for Horizontal and Vertical Transfers • Fast Clear Capability • Dynamic Range...60 dB Typical • High Blue Response • High Photoresponse Uniformity • Solid-State Reliability With No Image Burn-In, Residual Imaging, Image Distortion, Image Lag, or Microphonics • 6-Pin Dual-In-Line Ceramic Package • Square Image Area: – 2640 µm by 2640 µm – 192 Pixels (H) by 165 Pixels (V) – Each Pixel 13.75 µm (H) by 16 µm (V) description The TC211 is a full-frame charge-coupled device (CCD) image sensor designed specifically for industrial applications requiring ruggedness and small size. The image-sensing area is configured into 165 horizontal lines each containing 192 pixels. Twelve additional pixels are provided at the end of each line to establish a dark reference and line clamp. The antiblooming feature is activated by supplying clock pulses to the antiblooming gate, an integral part of each image-sensing element. The charge is converted to signal voltage at 4 µV per electron by a high-performance structure with built-in automatic reset and a voltage-reference generator. The signal is further buffered by a low-noise two-stage source-follower amplifier to provide high output-drive capability. The TC211 is supplied in a 6-pin dual-in-line ceramic package approximately 7,5 mm (0.3 in.) square. The glass window can be cleaned using any standard method for cleaning optical assemblies or by wiping the surface with a cotton swab soaked in alcohol. The TC211 is characterized for operation from – 10 °C to 45°C. This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to VSS. Under no circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUT to VSS during operation to prevent damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments. ADB VSS ABG OUT SRG IAG 4 5 6 3 2 1 DUAL-IN-LINE PACKAGE (TOP VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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