SN75LVDS88B

TFT LCD PANEL TIMING CONTROLLER

WITH LVDS INTERFACE

SLLS407 – FEBRUARY 2000

11

POST OFFICE BOX 655303

MECHANICAL DATA

PFD (S-PQFP-G100)

PowerPAD

™ PLASTIC QUAD FLATPACK (DIE DOWN)

0,13 NOM

50

26

Thermal Pad

(see Note D)

0,75

0,45

0,25

Seating Plane

4146930/A 12/97

Gage Plane

0,27

75

0,17

76

100

SQ

SQ

1

15,80

16,20

14,20

13,80

12,00 TYP

1,05

0,95

1,20 MAX

51

25

0,50

0,08

M

0,08

0

°–7°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by attaching an external heatsink to the thermal pad.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments Incorporated.