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SN74LVC1G08DCKRE4 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G08DCKRE4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 16 page SN74LVC1G08 SINGLE 2INPUT POSITIVEAND GATE SCES217S − APRIL 1999 − REVISED JUNE 2005 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 3.6 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) 3 2 4 5 1 AVCC Y B GND DBV PACKAGE (TOP VIEW) YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 5 1 AVCC Y B GND 3 2 4 5 1 AVCC Y B GND A GND VCC Y B DRL PACKAGE (TOP VIEW) See mechanical drawings for dimensions. 1 4 2 3 5 description/ordering information The SN74LVC1G08 performs the Boolean function Y + A • Bor Y + A ) B in positive logic. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.17-mm Small Bump − YEA SN74LVC1G08YEAR NanoFree − WCSP (DSBGA) 0.17-mm Small Bump − YZA (Pb-free) Reel of 3000 SN74LVC1G08YZAR _ _ _CE_ NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Reel of 3000 SN74LVC1G08YEPR _ _ _CE_ −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) SN74LVC1G08YZPR SOT (SOT-23) − DBV Reel of 3000 SN74LVC1G08DBVR C08_ SOT (SOT-23) − DBV Reel of 250 SN74LVC1G08DBVT C08_ SOT (SC-70) − DCK Reel of 3000 SN74LVC1G08DCKR SOT (SC-70) − DCK Reel of 250 SN74LVC1G08DCKT CE_ SOT (SOT-553) − DRL Reel of 4000 SN74LVC1G08DRLR CE_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2005, Texas Instruments Incorporated NanoStar and NanoFree are trademarks of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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