SN74LVC1G08

SINGLE 2INPUT POSITIVEAND GATE

SCES217S − APRIL 1999 − REVISED JUNE 2005

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

3

2

4

5

1

Y

B

GND

DBV PACKAGE

(TOP VIEW)

YEA, YEP, YZA,

OR YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

5

1

Y

B

GND

3

2

4

5

1

Y

B

GND

A

GND

Y

B

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

4

2

3

5

description/ordering information

The SN74LVC1G08 performs the Boolean function Y

+ A • Bor Y + A ) B in positive logic.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC1G08YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Reel of 3000

SN74LVC1G08YZAR

_ _ _CE_

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC1G08YEPR

_ _ _CE_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC1G08YZPR

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC1G08DBVR

C08_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC1G08DBVT

C08_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC1G08DCKR

SOT (SC-70) − DCK

Reel of 250

SN74LVC1G08DCKT

CE_

SOT (SOT-553) − DRL

Reel of 4000

SN74LVC1G08DRLR

CE_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2005, Texas Instruments Incorporated

NanoStar and NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.