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45280-2403 Datasheet(PDF) 1 Page - Molex Electronics Ltd. |
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45280-2403 Datasheet(HTML) 1 Page - Molex Electronics Ltd. |
1 / 2 page FEATURES AND SPECIFICATIONS 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density Power and Signal Applications The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI (Blind-Mate version with Compliant Pin Interface) are vertical header product extensions featuring press-fit PC tails. These headers are designed for high- density applications where press-fit terminations are required. The CPI products are appropriate for both power and signal uses as they can carry up to 5.0A of current per circuit. The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that mates with standard wire-mount housings and crimp terminals for wire-to-board applications. The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI components, which include panel-mount receptacles with crimp terminals and PCB receptacles for wire-to-board and board-to-board applications. Features and Benefits ■ CPI style (press-fit) pins require no soldering to the PCB ■ Designed for multiple board thicknesses of 2.36mm (.093”) or greater ■ Dual-row vertical headers available in 2-24 circuits for the standard version and 4-24 circuits for the BMI (blind-mate) version ■ Rated up to 5.0A of current for both power and signal applications in wire-to- board and board-to-board configurations ■ Fully polarized with positive locks for proper mating ■ Fully isolated contacts for electrical and mechanical integrity Reference Information Packaging:Tray UL File No.: E29179 CSA File No.: LR19980 TUV No.: R95107 Designed In: Millimeters Electrical Voltage: 250V Current: 5.0A Contact Resistance: 10 milliohms max. Dielectric Withstanding Voltage: 1500 VAC Insulation Resistance: 1000 Megohms min. Mechanical Insertion Force to PCB: 35.6N (8.0lb) per circuit max. Retention Force to PCB: 106.8N (24.0lb) per circuit min. Mating Force: 8.0N (1.8lb) per circuit max. Unmating Force: 3.6N (0.8lb) per circuit min. Durability: 30 cycles Physical Housing: High-temperature polymer, UL 94V-0 Contact: Brass alloy Plating: Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”) min. select Gold or 0.76µm (30µ”) min. select Gold PC tails – Tin/Lead Underplating: Nickel PCB Thickness: 2.36mm (.093”) min. Operating Temperature: -40 to +105° C |
Similar Part No. - 45280-2403 |
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Similar Description - 45280-2403 |
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