60

seconds

3±1

seconds

SUPERWORLD ELECTRONICS (S) PTE LTD

18.04.2008

PG. 4

Preheating

60

seconds

Times (min.)

30±3

15

15

30±3

Time : 500 hours

1. Appearance : No damage

2. Inductance change : Within ±15% of initial value

High Temperature

Resistance Test

Applied Current : Rated Current

Temperature : 105±2°C

Time : 500 hrs

2. Inductance change : Within ±10% of initial value

Measured : 50 times

1. Appearance : No damage

2. Inductance change : Within ±10% of initial value

1. Appearance : No damage

1. Appearance : No significant abnormality

2. Inductance change : Within ±10%

Thermal Shock

Humidity Resistance

Solder Heat Resistance

Reliability Test

Conditions of 1 cycle.

Applied Current : Rated Current

Humidity : 90% to 95%

Temperature : 40±2°C

Total : 50 cycles

Temperature (°C)

-40±2

+105±2

Room temp.

Room temp.

Step

1

4

2

3

265°C

150°C

Preheat : 150°C, 60sec.

Dip Time : 10±1sec.

Solder Temperature : 265±5°C

Solder : DD930C

cooling

10±1

seconds

Natural

Dipping

TEST CONDITION

Preheating

PDC3015C SERIES

PERFORMANCE

should be covered with solder.

More than 90% of the terminal electrode

SMD Power Inductors (Lead Free)

8. ELECTRICAL CHARACTERISTICS :

Mechanical Performance Test

Solderability Test

ITEM

Solder Temperature : 245±5°C

Flux for lead free : rosin

Dip Time : 3±1sec.

245°C

150°C

Preheat : 150°C, 60sec.

Solder : DD930C

cooling

Natural

Dipping

90~120sec

5sec max.

260°C max.

230°C

150~180°C

30sec max.

REFLOW SOLDERING CONDITION

Reflow times : 2 times max.

NOTE : Specifications subject to change without notice. Please check our website for latest information.