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L818HW-1R0MF Datasheet(PDF) 7 Page - Superworld Electronics |
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L818HW-1R0MF Datasheet(HTML) 7 Page - Superworld Electronics |
7 / 10 page SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 15.01.2008 L818HW SERIES 10. RELIABILITY AND TEST CONDITION : Electrical Characteristics Test defects harmful to the characteristics should not be allowed. Appearance : Cracking, shipping and any other 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Random Vibration Test Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Thermal Shock Low Temperature High Temperature Reliability Test Life Test Life Test Within 3 4 Room Temperature A period of 2 hours in each of 3 mutually perpendicular Directions & times : X, Y, Z directions for 2 hours. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm directions (Total 6 hours). Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Temperature : 40±5°C Total : 5 cycles Times (min.) 30±3 Within 3 30±3 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Temperature (°C) Room Temperature Conditions of 1 cycle. 1 3 2 Step -55±3 +125±3 Time : 500±12 hours Time : 500±12 hours Temperature : -55±5°C Temperature : 125±5°C 2. Inductance change : Within ±20% 1. Appearance : No significant abnormality Solder Heat Resistance Preheating 60 seconds 150°C 260°C 10±0.5 seconds Dipping Natural cooling Preheating 60 seconds 150°C 245°C 4±1 seconds Dipping Natural cooling Refer to standard electrical characteristics list More than 90% of the terminal electrode should be covered with solder. Solderability Test Mechanical Performance Test Saturation Current (Isat) Heat Rated Current (Irms) DCR Inductance Flux for lead free : rosin Solder : Sn99.95-Cu0.05 Flux for lead free : rosin Solder Temperature : 260±5°C Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Dip Time : 4±1sec. Irms(A) will cause the coil temperature rise approximately T=40°C without core loss HP4284A, CH11025, CH3302, CH1320, CH1320S CH16502, Agilent33420A Micro-Ohm Meter. Isat(A) will cause Lo to drop approximately 20% typ. 2. Temperature measured by digital surface thermometer Solder Temperature : 245±5°C Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 1. Applied the allowed DC current LCR meter. ITEM PERFORMANCE TEST CONDITION HIGH CURRENT MOLDED POWER INDUCTORS |
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