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L816 Datasheet(PDF) 7 Page - Superworld Electronics |
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L816 Datasheet(HTML) 7 Page - Superworld Electronics |
7 / 10 page SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 14.11.2008 L816 SERIES 10. RELIABILITY AND TEST CONDITION : LCR meter. Frequency : 10-55-10Hz for 1 min. Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular Irms(A) will cause the coil temperature rise approximately T=40°C without core loss CH16502, Agilent33420A Micro-Ohm Meter. 1. Applied the allowed DC current 60 seconds Isat(A) will cause Lo to drop approximately 20% Solder Temperature : 260±5°C Solder Temperature : 245±5°C 2. Temperature measured by digital surface thermometer Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Applied Current : Rated Curent 60 seconds Time : 500±12 hours Life Test Humidity : 90% to 95% RH Appearance : Cracking, shipping and any other defects harmful to the characteristics should not 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. be allowed. Random Vibration Test directions (Total 6 hours). Amplitude : 1.52mm Time : 500±12 hours 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. 1. Appearance : No damage Humidity Resistance Low Temperature Thermal Shock Life Test 1-55±3 Temperature : 40±5°C Total : 5 cycles Room Temperature Room Temperature 3 2 4 +125±3 Temperature (°C) Conditions of 1 cycle. Step Time : 500±12 hours Temperature : -55±5°C 2. Inductance change : Within ±20% 1. Appearance : No significant abnormality High Temperature Reliability Test Solder Heat Resistance Dip Time : 10±0.5sec. Temperature : 125±5°C 260°C 150°C Preheat : 150°C, 60sec. Flux for lead free : rosin Solder : Sn-Ag3.0-Cu0.5 150°C More than 90% of the terminal electrode should be covered with solder. Saturation Current (Isat) Solderability Test Mechanical Performance Test Heat Rated Current (Irms) DCR Dip Time : 4±1sec. Flux for lead free : rosin 245°C Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 30±3 30±3 Within 3 Within 3 Times (min.) 4±1 seconds cooling 10±0.5 seconds Preheating Dipping Natural Preheating Dipping Natural cooling TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S Refer to standard electrical characteristics list PERFORMANCE Electrical Characteristics Test ITEM Inductance HIGH CURRENT MOLDED POWER INDUCTORS |
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