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L814HW-1R5MF Datasheet(PDF) 5 Page - Superworld Electronics

Part # L814HW-1R5MF
Description  HIGH CURRENT MOLDED POWER INDUCTORS
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Manufacturer  SUPERWORLD [Superworld Electronics]
Direct Link  http://www.superworld.com.sg
Logo SUPERWORLD - Superworld Electronics

L814HW-1R5MF Datasheet(HTML) 5 Page - Superworld Electronics

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SUPERWORLD ELECTRONICS (S) PTE LTD
NOTE : Specifications subject to change without notice. Please check our website for latest information.
PG. 5
15.01.2008
L814HW SERIES
10. RELIABILITY AND TEST CONDITION :
cooling
260°C
10±0.5
seconds
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Life Test
Thermal Shock
Low Temperature
Life Test
High Temperature
Reliability Test
Times (min.)
Temperature (°C)
Step
Within 3
Within 3
Measure at room temperature after placing for 2 to 3 hrs.
Measure at room temperature after placing for 2 to 3 hrs.
Humidity : 90% to 95%
Applied Current : Rated Curent
Time : 500±12 hours
Temperature : 40±5°C
Room Temperature
Room Temperature
Total : 5 cycles
4
3
2
1
+125±3
-55±3
30±3
30±3
Measure at room temperature after placing for 2 to 3 hrs.
Measure at room temperature after placing for 2 to 3 hrs.
Time : 500±12 hours
Time : 500±12 hours
Temperature : -55±5°C
Conditions of 1 cycle.
Temperature : 125±5°C
60
seconds
150°C
2. Inductance change : Within ±20%
1. Appearance : No significant abnormality
Solder Heat Resistance
Refer to standard electrical characteristics list
More than 90% of the terminal electrode
should be covered with solder.
Solderability Test
Mechanical Performance Test
Saturation Current (Isat)
Heat Rated Current (Irms)
DCR
Inductance
Flux for lead free : rosin
Preheating
Flux for lead free : rosin
Solder Temperature : 260±5°C
Solder : Sn99.95-Cu0.05
Preheat : 150°C, 60sec.
Dip Time : 10±0.5sec.
Dipping
Natural
Preheating
60
seconds
Dip Time : 4±1sec.
150°C
230°C
4±1
seconds
Dipping
Natural
cooling
Irms(A) will cause the coil temperature rise
approximately
T=40°C without core loss
HP4284A, CH11025, CH3302, CH1320, CH1320S
CH16502, Agilent33420A Micro-Ohm Meter.
1. Applied the allowed DC current
Isat(A) will cause Lo to drop approximately 20% typical
2. Temperature measured by digital surface thermometer
Solder Temperature : 230±5°C
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
LCR meter.
ITEM
Electrical Characteristics Test
PERFORMANCE
TEST CONDITION
HIGH CURRENT MOLDED POWER INDUCTORS


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