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NCP1219 Datasheet(PDF) 5 Page - ON Semiconductor |
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NCP1219 Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 20 page NCP1219 http://onsemi.com 5 Table 2. MAXIMUM RATINGS (Notes 1 − 4) Rating Symbol Value Unit HV Voltage VHV −0.3 to 500 V HV Current IHV 100 mA Supply Voltage VCC −0.3 to 20 V Supply Current ICC 100 mA Skip/latch Voltage VSkip/latch −0.3 to 9.5 V Skip/latch Current ISkip/latch 100 mA FB Voltage VFB −0.3 to 5.0 V FB Current IFB 100 mA CS Voltage VCS −0.3 to 5.0 V CS Current ICS 100 mA DRV Voltage VDRV −0.3 to 20 V DRV Current IDRV −500 to 800 mA Operating Junction Temperature TJ –40 to 150 °C Storage Temperature Range Tstg –60 to 150 °C Power Dissipation (TA = 25°C, 2.0 Oz Cu, 1.0 Sq Inch Printed Circuit Copper Clad) D Suffix, Plastic Package Case 751U (SOIC−7) (Note 4) PD 0.92 W Thermal Resistance, Junction to Ambient (2.0 Oz Cu Printed Circuit Copper Clad) D Suffix, Plastic Package Case 751U (SOIC−7) Junction to Air, Low conductivity PCB (Note 3) Junction to Lead, Low conductivity PCB (Note 3) Junction to Air, High conductivity PCB (Note 4) Junction to Lead, High conductivity PCB (Note 4) RθJA RθJL RθJA RθJL 177 75 136 69 °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Pins 1– 6: Human Body Model 3000 V per JEDEC JESD22−A114−F. Pins 1– 6: Machine Model Method 300 V per JEDEC JESD22−A115−A. Pin 8 is the HV startup of the device and is rated to the maximum rating of the part, or 500 V. 2. This device contains Latch−Up protection and exceeds ±100 mA per JEDEC Standard JESD78. 3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow. |
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