NCP1219

http://onsemi.com

5

Rating

Symbol

Value

Unit

HV Voltage

−0.3 to 500

V

HV Current

100

mA

Supply Voltage

−0.3 to 20

V

Supply Current

100

mA

Skip/latch Voltage

−0.3 to 9.5

V

Skip/latch Current

100

mA

FB Voltage

−0.3 to 5.0

V

FB Current

100

mA

CS Voltage

−0.3 to 5.0

V

CS Current

100

mA

DRV Voltage

−0.3 to 20

V

DRV Current

−500 to 800

mA

Operating Junction Temperature

–40 to 150

°C

Storage Temperature Range

–60 to 150

°C

D Suffix, Plastic Package Case 751U (SOIC−7) (Note 4)

0.92

W

Thermal Resistance, Junction to Ambient (2.0 Oz Cu Printed Circuit Copper Clad)

D Suffix, Plastic Package Case 751U (SOIC−7)

Junction to Air, Low conductivity PCB (Note 3)

Junction to Lead, Low conductivity PCB (Note 3)

Junction to Air, High conductivity PCB (Note 4)

Junction to Lead, High conductivity PCB (Note 4)

177

75

136

69

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Pins 1– 6: Human Body Model 3000 V per JEDEC JESD22−A114−F.

Pin 8 is the HV startup of the device and is rated to the maximum rating of the part, or 500 V.

2. This device contains Latch−Up protection and exceeds ±100 mA per JEDEC Standard JESD78.

a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.

for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.