SN54LVT574, SN74LVT574

3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS

WITH 3-STATE OUTPUTS

SCBS139D – MAY 1992 – REVISED JULY 1995

2

POST OFFICE BOX 655303

FUNCTION TABLE

(each flip-flop)

INPUTS

OUTPUT

OE

CLK

D

Q

L

↑

H

H

L

↑

LL

L

H or L

X

Q0

H

X

X

Z

logic diagram (positive logic)

OE

1D

2

1D

3

2D

4

3D

5

4D

6

5D

11

CLK

1Q

19

2Q

18

3Q

17

4Q

16

5Q

15

6Q

14

7Q

13

8Q

12

7

6D

8

7D

9

8D

EN

1

OE

CLK

1D

1Q

1

11

2

19

To Seven Other Channels

1D

C1

C1

† This symbol is in accordance with ANSI/IEEE Std 91-1984

and IEC Publication 617-12.

– 0.5 V to 4.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 0.5 V to 7 V

. . . .

96 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN74LVT574

128 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

48 mA

. . . . . . . . . . . . . . . . . . . . . . . . .

SN74LVT574

64 mA

. . . . . . . . . . . . . . . . . . . . . . . . .

– 50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0.6 W

. . . . . . . . . . . . . . . . . . . .

DW package

1.6 W

. . . . . . . . . . . . . . . . . . .

PW package

0.7 W

. . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. This current flows only when the output is in the high state and VO > VCC.

3. The maximum package power dissipation is calculated using a junction temperature of 150

°C and a board trace length of 750 mils.

For more information, refer to the

Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology

Data Book, literature number SCBD002B.