PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-8404201VCA

ACTIVE

CDIP

J

14

1

TBD

Call TI

Call TI

5962-8404201VDA

ACTIVE

CFP

W

14

1

TBD

Call TI

Call TI

84042012A

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

8404201CA

ACTIVE

CDIP

J

14

1

TBD

A42 SNPB

N / A for Pkg Type

8404201DA

ACTIVE

CFP

W

14

1

TBD

A42

N / A for Pkg Type

JM38510/65102BCA

ACTIVE

CDIP

J

14

1

TBD

A42 SNPB

N / A for Pkg Type

SN54HC27J

ACTIVE

CDIP

J

14

1

TBD

A42 SNPB

N / A for Pkg Type

SN74HC27D

ACTIVE

SOIC

D

14

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DBR

ACTIVE

SSOP

DB

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DBRE4

ACTIVE

SSOP

DB

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DE4

ACTIVE

SOIC

D

14

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DR

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DRE4

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DT

ACTIVE

SOIC

D

14

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27DTE4

ACTIVE

SOIC

D

14

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27N

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74HC27NE4

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74HC27NSR

ACTIVE

SO

NS

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74HC27NSRE4

ACTIVE

SO

NS

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SNJ54HC27FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

SNJ54HC27J

ACTIVE

CDIP

J

14

1

TBD

A42 SNPB

N / A for Pkg Type

SNJ54HC27W

ACTIVE

CFP

W

14

1

TBD

A42

N / A for Pkg Type

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

PACKAGE OPTION ADDENDUM

www.ti.com

6-Dec-2006

Addendum-Page 1