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SN54BCT760 Datasheet(PDF) 1 Page - Texas Instruments

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Part No. SN54BCT760
Description  OCTAL BUFFERS/DRIVERS WITH OPEN-COLLECTOR OUTPUTS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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SN54BCT760 Datasheet(HTML) 1 Page - Texas Instruments

 
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SN54BCT760, SN74BCT760
OCTAL BUFFERS/DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SCBS034B – JULY 1989 – REVISED NOVEMBER 1993
Copyright
© 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Open-Collector Version of ′BCT244
Open-Collector Outputs Drive Bus Lines or
Buffer Memory Address Registers
ESD Protection Exceeds 2000 V Per
MIL-STD-883C Method 3015
Packages Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers,
and
bus-oriented
receivers
and
transmitters.
The
′BCT760 is organized as two 4-bit buffers/line
drivers with separate output-enable (OE) inputs.
When OE is low, the device passes data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
The SN54BCT760 is characterized for operation
over the full military temperature range of – 55
°C
to 125
°C. The SN74BCT760 is characterized for
operation from 0
°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
OE
A
Y
L
H
H
L
LL
H
X
H
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54BCT760 ...J OR W PACKAGE
SN74BCT760 . . . DW OR N PACKAGE
(TOP VIEW)
3
2
1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54BCT760 . . . FK PACKAGE
(TOP VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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