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SN54AHC00 Datasheet(PDF) 6 Page - Texas Instruments

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Part No. SN54AHC00
Description  QUADRUPLE 2-INPUT POSITIVE-NAND GATES
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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SN54AHC00 Datasheet(HTML) 6 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9682201Q2A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-9682201QCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
5962-9682201QDA
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
SN74AHC00D
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00DBLE
OBSOLETE
SSOP
DB
14
None
Call TI
Call TI
SN74AHC00DBR
ACTIVE
SSOP
DB
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00DGVR
ACTIVE
TVSOP
DGV
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74AHC00DR
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74AHC00NSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00PW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74AHC00PWLE
OBSOLETE
TSSOP
PW
14
None
Call TI
Call TI
SN74AHC00PWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74AHC00RGYR
ACTIVE
QFN
RGY
14
1000
Pb-Free
(RoHS)
CU SN
Level-2-260C-1 YEAR
SNJ54AHC00FK
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
SNJ54AHC00J
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
SNJ54AHC00W
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1


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