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TDA8025 Datasheet(PDF) 3 Page - NXP Semiconductors |
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TDA8025 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 38 page TDA8025_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 6 April 2009 3 of 38 NXP Semiconductors TDA8025 IC card interface [1] To enable the microcontroller to provide the required maximum voltage input level on XTAL1, VDD(INTF) must not exceed VDD(INTREGD) + 0.3 V. See Section 8.1 on page 7 for specific limitations on the maximum VDD(INTF) voltage and Table 8 on page 23 for the limits of XTAL1. [2] See Figure 12 on page 18. 5. Ordering information ICC supply current 0 V to 3 V - - 65 mA 0 V to 1.8 V - - 65 mA 0 V to 1.2 V - - 30 mA SR slew rate up or down 0.02 0.14 0.26 V/ µs General tdeact deactivation time total sequence [2] 35 80 100 µs Ptot total power dissipation Tamb = −25 °C to +85 °C - - 0.56 W Tamb ambient temperature −25 - +85 °C Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit Table 2. Ordering information Type number Package Name Description Version TDA8025HN HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 × 5 × 0.85 mm SOT617-1 |
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