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SMJ320C25GB Datasheet(PDF) 1 Page - Texas Instruments |
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SMJ320C25GB Datasheet(HTML) 1 Page - Texas Instruments |
1 / 36 page SMJ320C25, SMJ320C2550 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 1 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 D Military Temperature Range – –55 °C to 125°C D 100-ns or 80-ns Instruction Cycle Times D 544 Words of Programmable On-Chip Data RAM D 4K Words of On-Chip Program ROM D 128K Words of Data/Program Space D 16 Input and 16 Output Channels D 16-Bit Parallel Interface D Directly Accessible External Data Memory Space – Global Data Memory Interface D 16-Bit Instruction and Data Words D 16 × 16-Bit Multiplier With a 32-Bit Product D 32-Bit ALU and Accumulator D Single-Cycle Multiply/Accumulate Instructions D 0 to 16-Bit Scaling Shifter D Bit Manipulation and Logical Instructions D Instruction Set Support for Floating-Point Operations, Adaptive Filtering, and Extended-Precision Arithmetic D Block Moves for Data/Program Management D Repeat Instructions for Efficient Use of Program Space D Eight Auxiliary Registers and Dedicated Arithmetic Unit for Indirect Addressing D Serial Port for Direct Code Interface D Synchronization Input for Synchronous Multiprocessor Configurations D Wait States for Communication to Slow-Off-Chip Memories/Peripherals D On-Chip Timer for Control Operations D Three External Maskable User Interrupts D Input Pin Polled by Software Branch Instruction D 1.6-µm CMOS Technology D Programmable Output Pin for Signaling External Devices D Single 5-V Supply D On-Chip Clock Generator D Packaging: – 68-Pin Leaded Ceramic Chip Carrier (FJ Suffix) – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier (FD Suffix) Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. IACK MSC CLKOUT1 CLKOUT2 XF HOLDA DX FSX X2 CLKIN X1 BR STRB R/W PS IS DS VSS 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 VSS D7 D6 D5 D4 D3 D2 D1 D0 SYNC INT0 INT1 INT2 VCC DR FSR A0 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 68-Pin FJ and FD Packages (Top View) On products compliant to MILPRF38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. 12 3456789 10 11 A B C D E F G H J K L 68-Pin GB Package (Top View) |
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