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MSP50P34N16I2D Datasheet(PDF) 1 Page - Texas Instruments |
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MSP50P34N16I2D Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 9 page  MSP50C32, MSP50C33, MSP50C34 MSP50P34, MSP50C37, MSP50P37 MIXED-SIGNAL PROCESSORS SPSS019A – MAY 1997 – REVISED OCTOBER 1998 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Dual Programmable LPC-12 Speech Synthesizers D Simultaneous LPC and PCM Waveforms D 8-Bit Microprocessor with 61 instructions D 32 Twelve-Bit Words and 224 Bytes of RAM D 3.3V to 6.5V CMOS Technology for Low Power Dissipation D Direct Speaker Drive Capability D Mask Selectable Internal or External Clock D Internal Clock Generator that Requires No External Components D Two Software-Selectable Clock Speeds D 10-kHz or 8-kHz Speech Sample Rate description The MSP50x3x family uses a revolutionary architecture to combine an 8-bit microprocessor, two speech synthesizers, ROM, RAM, and I/O in a low-cost single-chip system. The architecture uses the same arithmetic logic unit (ALU) for the two synthesizers and the microprocessor, thus reducing chip area and cost and enabling the microprocessor to do a multiply operation in 0.8 µs. The MSP50x3x family features two independent channels of linear predictive coding (LPC), which synthesize high-quality speech at a low data rate. Pulse-code modulation (PCM) can produce music or sound effects. LPC and PCM can be added together to produce a composite result. For more information, see the MSP50x3x User’s Guide (literature number SPSU006). Table 1. MSP50x3x Family DEVICE AMOUNT OF ROM/PROM FEATURES MSP50C32 16K bytes mask ROM 9/10 I/O lines MSP50C33 32K bytes mask ROM 9/10 I/O lines MSP50C34 64K bytes mask ROM 9/10 I/O lines, 24 I/O lines in die form MSP50P34 64K bytes PROM 9/10 I/O lines MSP50C37 16K bytes mask ROM 18 I/O lines, A/D converter/analog amplifier MSP50P37 16K bytes PROM 18 I/O lines, A/D converter/analog amplifier Copyright © 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 N PACKAGE (TOP VIEW) OSC IN PA6 PA5 PA4 PA3 PA2 PA1 PB1/OSC OUT PA7 PB0 PA0 DAC + DAC – VDD VSS INIT Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. |
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