CY54/74FCT163T

2

(Above which the useful life may be impaired. For user guide-

lines, not tested.)

Storage Temperature

.....................................−65°C to +150°C

Ambient Temperature with

Power Applied

..................................................−65°C to +135°C

Supply Voltage to Ground Potential

..................−0.5V to +7.0V

DC Input Voltage

.................................................−0.5V to +7.0V

DC Output Voltage

..............................................−0.5V to +7.0V

DC Output Current (Maximum Sink Current/Pin) ...... 120 mA

Power Dissipation .......................................................... 0.5W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Inputs

Action on the Rising

Clock Edge(s)

SR

PE

CET

CEP

L

H

H

H

H

X

L

H

H

H

X

X

H

L

X

X

X

H

X

L

Reset (Clear)

Count (Incremental)

No Charge (Hold)

No Charge (Hold)

Pin Description

Name

Description

CEP

Count Enable Parallel Input

CET

Count Enable Trickle Input

CP

Clock Pulse Input (Active Rising Edge)

SR

Synchronous Reset Input (Active LOW)

P

Parallel Data Inputs

PE

Parallel Enable Input (Active LOW)

Q

Flip-Flop Outputs

TC

Terminal Count Output

Operating Range

Range

Range

Ambient

Temperature

Commercial

All

−40°C to +85°C

5V

± 5%

All

−55°C to +125°C

5V

± 10%

Parameter

Description

Test Conditions

Min.

Max.

Unit

Output HIGH Voltage

Com’l

2.0

V

Com’l

2.4

3.3

V

Mil

2.4

3.3

V

Output LOW Voltage

Com’l

0.3

0.55

V

Mil

0.3

0.55

V

Input HIGH Voltage

2.0

V

Input LOW Voltage

0.8

V

All inputs

0.2

V

Input Clamp Diode Voltage

−0.7

−1.2

V

Input HIGH Current

5

µA

Input HIGH Current

±1

µA

Input LOW Current

±1

µA

−60

−120

−225

mA

Power-Off Disable

±1

µA

Notes:

1.

H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.

2.

Unless otherwise noted, these limits are over the operating free-air temperature range.

3.

4.

5.

6.

This parameter is specified but not tested.

7.

Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of

a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter