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L9D125G80BG4 Datasheet(PDF) 17 Page - LOGIC Devices Incorporated |
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L9D125G80BG4 Datasheet(HTML) 17 Page - LOGIC Devices Incorporated |
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17 / 45 page  LOGIC Devices Incorporated www.logicdevices.com Feb 2, 2009 LDS-L9D125G80BG4-C 17 2.5 Gb, DDR - SDRAM Integrated Module (IMOD) PreLIMINArY INforMAtIoN L9D125G80BG4 High Performance, Integrated Memory Module Product The BURST TERMINATE command is used to truncate READ bursts. The most recently registered READ command prior to the BURST TER- MINATE command will be truncated. The open page which the READ burst was terminated from, remains open. Burst terminate ABsolute maximum ratings AUTO REFRESH is used during normal operations of the IMOD and is analogous to CASx\-BEFORE-RASx\ (CBR) REFRESH in conventional DRAMs. This command is non-persistent so it must be issued each time a REFRESH is required. The addressing is generated by the internal REFRESH controller. This makes the address bits “Don’t Care” during an AUTO REFRESH com- mand. Each DDR die within the IMOD, requires AUTO REFRESH cycles at an average of 7.8125 us (maximum). To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute REFRESH interval is provided. A maximum of eight AUTO REFRESH commands can be posted to any given DDR die, meaning that the maximum absolute interval between any AUTO REFRESH command is 9 x 7.8125uS (70.3uS). This maximum absolute interval is to allow future support for DLL updates internal to the DDR SDRAM die. Although not a JEDEC requirement, to provide for future functionality enhancements, CKEx must be active (HIGH) during the AUTO REFRESH period. The AUTO REFRESH period begins when the AUTO REFRESH command is registered and ends tRFC later. Auto reFresh The SELF REFRESH command can be used to retain data in the DDR IMOD even if the rest of the system is powered down. When in the SELF REFRESH mode, the DDR IMOD retains data without external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH com- mand except CKEx is disabled (LOW). The DLL is automatically enabled upon entering SELF REFRESH (200 clock cycles must then occur before a READ command can be issued). Input signals except CLEx are “Don’t Care” during SELF REFRESH. The procedure for exiting SELF REFRESH requires a sequence of com- mands. First, CLKx must be stable prior to CKEx going back to HIGH. Once CLEx is HIGH, the DDR die must have a NOP command issued for tXSNR, because time is required for the completion of any internal REFRESH in progress. A simple algorithm for meeting both REFRESH and DLL requirements is to apply NOPs for 200 clock cycles before applying any other command. SelF reFresh Parameter MIN MAX UNITS V V V V C mA +3.6V +3.6V +3.6V VCCQ + 0.5V +150 50 -1.0V -1.0V -1.0V -0.5V -55 −− VCC Supply Voltage relative to VSS VCCQ I/O Supply Voltage relative to VSS VREF and inputs Voltage relative to VSS I/O pins Voltage relative to VSS Storage Temperature Short circuit current CaPacitance Parameter SYMBOL MAX UNITS pF pF pF pF 5 30 7 8 Input Capacitance [CKx\CKx\] Addresses, BA0-1 Input Capacitance [All other Input Pins] DQ line Cl1 CA C12 C10 |
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