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SS-241 R5

Notes:

and T) must be within .002" (0.05) mm min. and .020" (0.50) mm max. The clearance allowed must also prevent rotation of the component

within the cavity of not more than 20 degrees (see examples C & D).

2. Tape with components shall pass

around radius "R" without damage.

3. .043" (1.1) mm base tape and

.063" (1.6) mm max. for

non-paper base compositions.

Maximum Component Rotation

Side or Front Sectional View

Example "C"

20°

Top View Example "D"

20° Maximum Component Rotation

Typical component

cavity center line

Typical component

center line

T

Maximum Component Rotation

Side or Front Sectional View

Example "C"

20°

Top View Example "D"

20° Maximum Component Rotation

Typical component

cavity center line

Typical component

center line

T

Spec if i ca ti ons gi v en h er ei n m ay be c hanged at any ti m e wi t hout pr i or noti c e. Pl eas e c onf ir m tec hni c al s peci f i cat i ons bef or e y ou or der a nd/or use .

10. Carrier Tape Specifications (continued)

Punched paper tape

8 & 12mm

11. Recommended Land Pattern Dimensions

Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering.

Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is:

• Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this.

• Pad overlap 0.5mm beneath component

• Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering

A

B

C

C

D

Dimensions inches (mm)

Case Size

A

B

C

D

0402

0.02

0.07

0.02

0.02

(0.50)

(1.70)

(0.60)

(0.50)

0603

0.03

0.09

0.03

0.03

(0.75)

(2.30)

(0.80)

(0.70)

0805

0.05

0.12

0.04

0.04

(1.25)

(3.00)

(1.00)

(1.00)

1206

0.06

0.16

0.04

0.09

(1.60)

(4.00)

(1.00)

(2.00)

1210

0.10

0.16

0.04

0.09

(2.50)

(4.00)

(1.00)

(2.00)