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X5R0603CTTP225K Datasheet(PDF) 8 Page - KOA Speer Electronics, Inc. |
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X5R0603CTTP225K Datasheet(HTML) 8 Page - KOA Speer Electronics, Inc. |
8 / 8 page PAGE 8 OF 8 SS-241 R5 Notes: 1. A0, B0 and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The clearance between the ends of the terminals or body of the components to the sides and depth of the cavity (A0, B0 and T) must be within .002" (0.05) mm min. and .020" (0.50) mm max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see examples C & D). 2. Tape with components shall pass around radius "R" without damage. 3. .043" (1.1) mm base tape and .063" (1.6) mm max. for non-paper base compositions. Maximum Component Rotation Side or Front Sectional View Example "C" 20° Top View Example "D" 20° Maximum Component Rotation Typical component cavity center line Typical component center line B O AO T Maximum Component Rotation Side or Front Sectional View Example "C" 20° Top View Example "D" 20° Maximum Component Rotation Typical component cavity center line Typical component center line B O AO T Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Spec if i ca ti ons gi v en h er ei n m ay be c hanged at any ti m e wi t hout pr i or noti c e. Pl eas e c onf ir m tec hni c al s peci f i cat i ons bef or e y ou or der a nd/or use . 10. Carrier Tape Specifications (continued) Punched paper tape 8 & 12mm 11. Recommended Land Pattern Dimensions Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is: • Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. • Pad overlap 0.5mm beneath component • Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering A B C C D Dimensions inches (mm) Case Size A B C D 0402 0.02 0.07 0.02 0.02 (0.50) (1.70) (0.60) (0.50) 0603 0.03 0.09 0.03 0.03 (0.75) (2.30) (0.80) (0.70) 0805 0.05 0.12 0.04 0.04 (1.25) (3.00) (1.00) (1.00) 1206 0.06 0.16 0.04 0.09 (1.60) (4.00) (1.00) (2.00) 1210 0.10 0.16 0.04 0.09 (2.50) (4.00) (1.00) (2.00) |
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