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LTC3250ES6-1.5 Datasheet(PDF) 9 Page - Linear Technology |
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LTC3250ES6-1.5 Datasheet(HTML) 9 Page - Linear Technology |
9 / 12 page LTC3250-1.5/LTC3250-1.2 9 3250fa OPERATIO (Refer to Simplified Block Diagram) Figure 3. Maximum Power Dissipation vs Ambient Temperature Thermal Management For higher input voltages and maximum output current there can be substantial power dissipation in the LTC3250-1.5/LTC3250-1.2. If the junction temperature increases above approximately 160 °C the thermal shut- down circuitry will automatically deactivate the output. To reduce the maximum junction temperature, a good ther- mal connection to the PC board is recommended. Con- necting the GND pin (Pin 2) to a ground plane, and maintaining a solid ground plane under the device can reduce the thermal resistance of the package and PC board considerably. Derating Power at Higher Temperatures To prevent an overtemperature condition in high power applications Figure 3 should be used to determine the maximum combination of ambient temperature and power dissipation. The power dissipated in the LTC3250-1.5/ LTC3250-1.2 should always fall under the line shown (i.e. within the safe region) for a given ambient temperature. The power dissipated in the LTC3250-1.5/LTC3250-1.2 is given by the expression: P V VI D IN OUT OUT = 2 – This derating curve assumes a maximum thermal resis- tance, θJA , of 175°C/W for the 6-pin ThinSOT-23. This thermal resistances can be achieved from a printed circuit board layout with a solid ground plane (2000mm2)on at least one layer with a good thermal connection to the ground pin of the LTC3250-1.5/LTC3250-1.2. Operation outside of this curve will cause the junction temperature to exceed 140 °C which may trigger the thermal shutdown circuitry and ultimately reduce the life of the device. AMBIENT TEMPERATURE ( °C) –50 –25 025 50 3250 • F03 75 100 θJA = 175°C/W TJ = 140°C 1.2 1.0 0.8 0.6 0.4 0.2 0 |
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