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LTC2295UP Datasheet(PDF) 18 Page - Linear Technology |
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LTC2295UP Datasheet(HTML) 18 Page - Linear Technology |
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18 / 24 page  LTC2295 2295fa 18 APPLICATIO S I FOR ATIO Digital Output Multiplexer The digital outputs of the LTC2295 can be multiplexed onto a single data bus. The MUX pin is a digital input that swaps the two data busses. If MUX is High, Channel A comes out on DA0-DA13, OFA; Channel B comes out on DB0-DB13, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0-DB13, OFB; Channel B comes out on DA0-DA13, OFA. To multiplex both channels onto a single output bus, connect MUX, CLKA and CLKB together (see the Timing Diagram for the multiplexed mode). The multiplexed data is available on either data bus—the un- used data bus can be disabled with its OE pin. Grounding and Bypassing The LTC2295 requires a printed circuit board with a clean, unbroken ground plane. A multilayer board with an inter- nal ground plane is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capacitors must be located as close to the pins as possible. Of particular importance is the 0.1 µF capacitor between REFH and REFL. This capacitor should be placed as close to the device as possible (1.5mm or less). A size 0402 ceramic capacitor is recommended. The large 2.2 µF capacitor between REFH and REFL can be somewhat further away. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2295 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Heat Transfer Most of the heat generated by the LTC2295 is transferred from the die through the bottom-side exposed pad and package leads onto the printed circuit board. For good electrical and thermal performance, the exposed pad should be soldered to a large grounded pad on the PC board. It is critical that all ground pins are connected to a ground plane of sufficient area. |
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