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LTC1864L Datasheet(PDF) 11 Page - Linear Technology

Part No. LTC1864L
Description  μPower, 3V, 16-Bit, 150ksps 1- and 2-Channel ADCs in MSOP
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Maker  LINER [Linear Technology]
Homepage  http://www.linear.com
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LTC1864L Datasheet(HTML) 11 Page - Linear Technology

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11
LTC1864L/LTC1865L
sn18645L 18645Lfs
GENERAL ANALOG CONSIDERATIONS
Grounding
The LTC1864L/LTC1865L should be used with an analog
ground plane and single point grounding techniques. Do
not use wire wrapping techniques to breadboard and
evaluate the device. To achieve the optimum performance,
use a printed circuit board. The ground pins (AGND and
DGND for the LTC1865L MSOP package and GND for the
LTC1864L and LTC1865L SO-8 package) should be tied
directly to the analog ground plane with minimum lead
length.
Bypassing
For good performance, the VCC and VREF pins must be free
of noise and ripple. Any changes in the VCC/VREF voltage
with respect to ground during the conversion cycle can
induce errors or noise in the output code. Bypass the VCC
and VREF pins directly to the analog ground plane with a
minimum of 1µF tantalum. Keep the bypass capacitor
leads as short as possible.
Analog Inputs
Because of the capacitive redistribution A/D conversion
techniques used, the analog inputs of the LTC1864L/
LTC1865L have capacitive switching input current spikes.
These current spikes settle quickly and do not cause a
problem if source resistances are less than 200Ω or high
speed op amps are used (e.g., the LT
®1211, LT1469,
LT1807, LT1810, LT1630, LT1226 or LT1215). But if large
source resistances are used, or if slow settling op amps
drive the inputs, take care to ensure the transients caused
by the current spikes settle completely before the conver-
sion begins.
APPLICATIO S I FOR ATIO
VIN*
*VIN = (SELECTED “+” CHANNEL) –
(SELECTED “–” CHANNEL)
REFER TO TABLE 1
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0
1864 F05
Figure 5. LTC1865L Transfer Curve


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