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APA075-FTQM Datasheet(PDF) 35 Page - Actel Corporation |
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APA075-FTQM Datasheet(HTML) 35 Page - Actel Corporation |
35 / 174 page ProASICPLUS Flash Family FPGAs v5.7 1-29 Package Thermal Characteristics The ProASICPLUS family is available in several package types with a range of pin counts. Actel has selected packages based on high pin count, reliability factors, and superior thermal characteristics. Thermal resistance defines the ability of a package to conduct heat away from the silicon, through the package to the surrounding air. Junction-to-ambient thermal resistance is measured in degrees Celsius/Watt and is represented as Theta ja (Θja). The lower the thermal resistance, the more efficiently a package will dissipate heat. A package’s maximum allowed power (P) is a function of maximum junction temperature (TJ), maximum ambient operating temperature (TA), and junction-to-ambient thermal resistance Θja. Maximum junction temperature is the maximum allowable temperature on the active surface of the IC and is 110° C. P is defined as : EQ 1-4 Θ ja is a function of the rate (in linear feet per minute (lfpm)) of airflow in contact with the package. When the estimated power consumption exceeds the maximum allowed power, other means of cooling, such as increasing the airflow rate, must be used. The maximum power dissipation allowed for a Military temperature device is specified as a function of Θjc. The absolute maximum junction temperature is 150°C. The calculation of the absolute maximum power dissipation allowed for a Military temperature application is illustrated in the following example for a 456-pin PBGA package: EQ 1-5 P T J TA – Θja ------------------- = Table 1-15 • Package Thermal Characteristics Plastic Packages Pin Count θ jc θ ja Units Still Air 1.0 m/s 200 ft./min. 2.5 m/s 500 ft./min. Thin Quad Flat Pack (TQFP) 100 14.0 33.5 27.4 25.0 °C/W Thin Quad Flat Pack (TQFP) 144 11.0 33.5 28.0 25.7 °C/W Plastic Quad Flat Pack (PQFP)1 208 8.0 26.1 22.5 20.8 °C/W PQFP with Heat spreader2 208 3.8 16.2 13.3 11.9 °C/W Plastic Ball Grid Array (PBGA) 456 3.0 15.6 12.5 11.6 °C/W Fine Pitch Ball Grid Array (FBGA) 144 3.8 26.9 22.9 21.5 °C/W Fine Pitch Ball Grid Array (FBGA) 256 3.8 26.6 22.8 21.5 °C/W Fine Pitch Ball Grid Array (FBGA)3 484 3.2 18.0 14.7 13.6 °C/W Fine Pitch Ball Grid Array (FBGA)4 484 3.2 20.5 17.0 15.9 °C/W Fine Pitch Ball Grid Array (FBGA) 676 3.2 16.4 13.0 12.0 °C/W Fine Pitch Ball Grid Array (FBGA) 896 2.4 13.6 10.4 9.4 °C/W Fine Pitch Ball Grid Array (FBGA) 1152 1.8 12.0 8.9 7.9 °C/W Ceramic Quad Flat Pack (CQFP) 208 2.0 22.0 19.8 18.0 °C/W Ceramic Quad Flat Pack (CQFP) 352 2.0 17.9 16.1 14.7 °C/W Ceramic Column Grid Array (CCGA/LGA) 624 6.5 8.9 8.5 8.0 °C/W Notes: 1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300 2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000 3. Depopulated Array 4. Full array Maximum Power Allowed Max. junction temp. ( °C) Max. case temp. (°C) – θ jc(°C/W) ------------------------------------------------------------------------------------------------------------------------ 150 °C 125°C – 3.0 °C/W -------------------------------------- 8.333W = = = |
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