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RTSX72SU-CQ256M Datasheet(PDF) 4 Page - Actel Corporation |
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RTSX72SU-CQ256M Datasheet(HTML) 4 Page - Actel Corporation |
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4 / 83 page  RTSX-SU RadTolerant FPGAs (UMC) iv v2.2 Actel Extended Flow1 Step Screen Method Requirement 1. Destructive In-Line Bond Pull3 2011, Condition D Sample 2. Internal Visual 2010, Condition A 100% 3. Serialization 100% 4. Temperature Cycling 1010, Condition C 100% 5. Constant Acceleration 2001, Condition B or D, Y1 Orientation Only 100% 6. Particle Impact Noise Detection 2020, Condition A 100% 7. Radiographic 2012 (one view only) 100% 8. Pre-Burn-In Test In accordance with applicable Actel device specification 100% 9. Dynamic Burn-In 1015, Condition D, 240 hours at 125°C or 120 hours at 150°C minimum 100% 10. Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification 100% 11. Static Burn-In 1015, Condition C, 72 hours at 150°C or 144 hours at 125°C minimum 100% 12. Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification 100% 13. Percent Defective Allowable (PDA) Calculation 5%, 3% Functional Parameters at 25°C All Lots 14. Final Electrical Test a. Static Tests (1)25°C (Subgroup 1, Table1) (2)–55°C and +125°C (Subgroups 2, 3, Table 1) b. Functional Tests (1)25°C (Subgroup 7, Table 15) (2)–55°C and +125°C (Subgroups 8A and B, Table 1) c. Switching Tests at 25°C (Subgroup 9, Table 1) In accordance with Actel applicable device specification which includes a, b, and c: 5005 5005 5005 5005 5005 100% 100% 100% 100% 15. Seal a. Fine b. Gross 1014 100% 16. External Visual 2009 100% Notes: 1. Actel offers Extended Flow for users requiring additional screening beyond MIL-STD-833, Class B requirement. Actel offers this Extended Flow incorporating the majority of the screening procedures as outlined in Method 5004 of MIL-STD-883, Class S. The exceptions to Method 5004 are shown in notes 2 and 4 below. 2. MIL-STD-883, Method 5004, requires a 100 percent radiation latch-up testing to Method 1020. Actel will NOT perform any radiation testing, and this requirement must be waived in its entirety. 3. Method 5004 requires a 100 percent, nondestructive bond-pull to Method 2003. Actel substitutes a destructive bond-pull to Method 2011 Condition D on a sample basis only. 4. Wafer lot acceptance complies to commercial standards only (requirement per Method 5007 is not performed). |
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