RTAX-DSP Radiation-Tolerant FPGAs

Pro d uct Br ief

v

Actel "EV" Flow (Class V Flow Equivalent Processing)

Table 4 •

Step

Screen

Method

Requirement

1

2011, Condition D

Extended Sample

2

Internal Visual

2010, Condition A

100%

3

Serialization

100%

4

Temperature Cycling

1010, Condition C, 50 cycles minimum

100%

5

Constant Acceleration

2001, Y1 Orientation Only

Condition TBD

100%

6

Particle Impact Noise Detection

2020, Condition A

100%

7

Radiographic (X-Ray)

2012, One View (Y1 Orientation) Only

100%

8

Pre-Burn-In Electrical Parameters

In

accordance

with

applicable

Actel

device

specification

100%

9

Dynamic Burn-In

1015, Condition D,

240 hours at 125°C or 120 hours at 150°C

minimum

100%

10

Interim (Post-Dynamic-Burn-In) Electrical Parameters In

accordance

with

applicable

Actel

device

specification

100%

11

Static Burn-In

1015, Condition C, 72 hours at 150°C or 144 hours

at 125°C minimum

100%

12

Interim (Post-Static-Burn-In) Electrical Parameters

In

accordance

with

applicable

Actel

device

specification

100%

13

Percent Defective Allowable (PDA) Calculation

5% Overall, 3% Functional Parameters at 25°C

All Lots

14

a. Static Tests

(1) 25°C

(2) –55°C and +125°C

b. Functional Tests

(1) 25°C

(2) –55°C and +125°C

c. Switching Tests at 25°C

In

accordance

with

applicable

Actel

device

specification, which includes a, b, and c:

5005, Table 1, Subgroup 1

5005, Table 1, Subgroup 2, 3

5005, Table 1, Subgroup 7

5005, Table 1, Subgroup 8a, 8b

5005, Table 1, Subgroup 9

100%

15

Seal (Fine & Gross Leak Test)

1014

100%

16

External Visual

2009

100%

17

Wafer Lot Specific Life Test (Group C)

MIL-PRF-38535, Appendix B, sec. B.4.2.c

All Wafer Lots

Notes:

1. Actel offers "EV" flow for users requiring full compliance to the MIL-PRF-38535 Class V requirement.

The "EV" process flow is expanded from the existing E-flow requirement (it still meets the full SMD requirement for current E-flow

devices) with the intention to be in full compliance to the MIL-PRF-38535 Table IA and Appendix B requirement, but without the

official Class V certification from DSCC.

2. For CCGA devices, all Assembly/Screening/TCI testing is performed at LGA level. Only QA electrical and mechanical visual tests are

performed after solder column attachment.

3. The requirement for 100% nondestructive bond pull per Method 2003 is fulfilled by substitution of an extensive extended sample

basis.

4. Read and record performed at –55°C and +125°C (no delta calculation).