Ball / Land Grid Array Sockets

Twist Lock Type

E-tec is now the leading BGA socket manufacturer.

EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.

Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed

and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional

board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with

no fixing holes.

We aim to solve your requirements - many different terminals and configurations are available.

Your custom sets our standards!

Please note, we will always request the chip data to ensure we offer a compatible socket.

SMT Style

PCB Pad Layout

Ø 0,60mm/.024“ if pitch 1,27mm

Ø 0,50mm/.020“ if pitch 1,00mm

Ø 0,40mm/.016“ if pitch 0,80mm

Ø 0,35mm/.014“ if pitch 0,75mm

Ø 0,35mm/.014“ if pitch 0,65mm

Ø 0,30mm/.012“ if pitch 0,50mm

You may request any specific socket dimension from

info@e-tec.com

For top view socket dimension

pls. ref. to separate catalog page

Important Note:

Please check the ball diameters & heights of your chip prior to

ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation

has to be communicated to E-tec in order to check compatibility with

the standard socket design and if necessary to obtain a special order

code adapted to your chip dimensions.

The standard solderball diameters & heights are the following:

Pitch

ball

diameters

ball

height

min/max

min/max

0.50mm

0.25mm / 0.35mm

0.15mm / 0.30mm

0.65mm

0.25mm / 0.45mm

0.15mm / 0.30mm

0.75mm

0.25mm / 0.45mm

0.15mm / 0.40mm

0.80mm

0.40mm / 0.55mm

0.25mm / 0.45mm

1.00mm

0.50mm / 0.70mm

0.30mm / 0.50mm

1.27mm & 1.50mm

0.60mm / 1.00mm

0.50mm / 0.70mm

0.60mm / 1.00mm

0.80mm / 1.00mm

If the minimum ball diameter of a given chip falls below the above

indications, then a BUW socket will generally be proposed.

Soldertail Style

Soldertail:

Ø 0,42mm/.016” if pitch 1,27mm

Ø 0,29mm/.011” if pitch 1,00mm

Ø 0,29mm/.011” if pitch 0,80mm

Ø 0,27mm/.010” if pitch 0,75mm

Ø 0,27mm/.010” if pitch 0,65mm

Ø 0,27mm/.010” if pitch 0,50mm

PCB Hole Layout

PCB solder hole:

Ø 0,60mm/.024” if pitch 1,27mm

Ø 0,50mm/.020” if pitch 1,00mm

Ø 0,40mm/.016” if pitch 0,80mm

Ø 0,35mm/.014” if pitch 0,75mm

Ø 0,35mm/.014” if pitch 0,65mm

Ø 0,35mm/.014” if pitch 0,50mm

The pitch dimension depends on your Ball Grid Array

Specifications

Mechanical data

Contact life

Retention System life

Solderability

Individual contact force

Max. torque for retention screws

Material

Electrical data

Contact resistance

Current rating

Insulation resistance at 500V DC

Breakdown voltage at 60 Hz

Capacitance

Inductance

Operating temperature

10.000 cycles min.

1.000 cycles min.

exceeds MIL-STD-202 Method 208

40 grams max.

up to 800 pins = 7cNm or 10 oz-inch

as of 800 pins = 7cNm to 10cNm or 10 oz

to 14 oz-inch

High temp plastic or epoxy FR4

Brass

BeCu

< 100 m

Ω

500 mA max.

100 MΩ if 0.50 to 0.80mm pitch

500 MΩ 1.00mm pitch upwards

500V min.

< 1 pF

< 2 nH

−55°C to +125°C ; 260°C for 60 sec.

Recommendations

Torque limiting screw driver

Refer to page “Tools” of this catalog

Solder paste

Please use a solder paste w/o any silver!

Solder profile

How to order

optional for locating pegs

Device Type

Device Material

Pitch

Grid Code Config Code

Plating

ceramic device

plastic device

small diameter solderballs

05 = 0,50mm

06 = 0,65mm

07 = 0,75mm

08 = 0,80mm

10 = 1,00mm

12 = 1,27mm

15 = 1,50mm

others on

request

will be given by the factory

after receipt of the chip

datasheet

(tin leadfree)

Nbr of contacts

Contact Type

depends on

ballcount of chip

8