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TC1426 Datasheet(PDF) 2 Page - TelCom Semiconductor, Inc

Part No. TC1426
Description  1.2A DUAL HIGH-SPEED MOSFET DRIVERS
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Maker  TELCOM [TelCom Semiconductor, Inc]
Homepage  http://www.telcom-semi.com
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TC1426 Datasheet(HTML) 2 Page - TelCom Semiconductor, Inc

   
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TELCOM SEMICONDUCTOR, INC.
1.2A DUAL HIGH-SPEED MOSFET DRIVERS
TC1426
TC1427
TC1428
ELECTRICAL CHARACTERISTICS: TA = 25
°C with 4.5V ≤ VDD+ ≤ 16V unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
Input
VIH
Logic 1, Input Voltage
3
V
VIL
Logic 0, Input Voltage
0.8
V
IIN
Input Current
0V
≤ VIN ≤ VDD
– 1
1
µA
Output
VOH
High Output Voltage
Test Figures 1 and 2
VDD – 0.025
V
VOL
Low Output Voltage
Test Figures 1 and 2
0.025
V
RO
Output Resistance
VIN = 0.8V,
12
18
IOUT = 10 mA, VDD = 16V
VIN = 3V,
8
12
IOUT = 10 mA, VDD = 16V
IPK
Peak Output Current
1.2
A
I
Latch-Up Current
Withstand Reverse Current
> 500
mA
Switching Time (Note 1)
tR
Rise Time
Test Figures 1 and 2
35
nsec
tF
Fall Time
Test Figures 1 and 2
25
nsec
tD1
Delay Time
Test Figures 1 and 2
75
nsec
tD2
Delay Time
Test Figures 1 and 2
75
nsec
Power Supply
IS
Power Supply Current
VIN = 3V (Both Inputs)
9
mA
VIN = 0V (Both Inputs)
0.5
Note: 1. Switching times guaranteed by design.
ABSOLUTE MAXIMUM RATINGS*
Power Dissipation (TA
≤ 70°C)
Plastic DIP ........................................................... 730W
SOIC ................................................................ 470 mW
Derating Factor
Plastic DIP ..................................................... 8 mW/
°C
SOIC .............................................................. 4 mW/
°C
Supply Voltage ............................................................ 18V
Input Voltage, Any Terminal .. (V
DD + 0.3V) to (GND – 0.3V)
Operating Temperature : C Version .............. 0
°C to +70°C
E Version ......... – 40
°C to +85°C
*Stresses above those listed under "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions above
those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
Maximum Chip Temperature ................................. +150
°C
Storage Temperature ............................. +65
°C to +150°C
Lead Temperature (Soldering ,10 sec) ................. +300
°C


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