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TC1072 Datasheet(PDF) 3 Page - TelCom Semiconductor, Inc

Part No. TC1072
Description  50mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS
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Maker  TELCOM [TelCom Semiconductor, Inc]
Homepage  http://www.telcom-semi.com
Logo TELCOM - TelCom Semiconductor, Inc

TC1072 Datasheet(HTML) 3 Page - TelCom Semiconductor, Inc

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TC1072
3
PRELIMINARY INFORMATION
TC1072-01
6/16/97
50mA CMOS LDO WITH SHUTDOWN,
ERROR OUTPUT AND VREF BYPASS
Pin No.
(SOT-23A-6)
Symbol
Description
1VIN
Unregulated supply input.
2
GND
Ground terminal.
3
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this
input. The regulator enters shutdown when a logic low is applied to this input. During
shutdown, output voltage falls to zero and supply current is reduced to 0.05 microamp
(typical).
4
ERROR
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-
tolerance by approximately – 5%.
5
Bypass
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
6VOUT
Regulated voltage output.
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25
°C, unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
ERROR Open Drain Output
VMIN
Minimum Operating Voltage
1.0
V
VOL
Output Logic Low Voltage
1mA Flows to ERROR
400
mV
VTH
ERROR Threshold Voltage
See Figure 2
0.95 x VR
—V
VHYS
ERROR Positive Hysteresis
Note 8
50
mV
NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.2V, 3.3V, 3.8V 5.0V.
2. TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load
current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD).
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see
Thermal Considerations section of this data sheet for more details.
8. Hysteresis voltage is referenced by VR.
PIN DESCRIPTION


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