Apr. 2008 Release / Orig

Page 2

Preliminary Data Sheet

NOTE:

(1) Thermal resistance from junction to ambient at 0.375” lead length, vertical P.C. board mounted

(2) Reverse Recovery Test Conditions: I

Package Outline

Package

Case Outline

DO-41

DO-41

Millimeters

Inches

DIM

Min

Max

Min

Max

A

0.69

0.90

0.027

0.034

B

4.20

5.20

0.166

0.205

C

25.40

---

1.000

---

D

2.00

2.70

0.080

0.107

A

D

B

C