XD010-51S-D4F 902-928 MHz 15W Power Amp Module

303 S. Technology Court

Phone: (800) SMI-MMIC

http://www.sirenza.com

Broomfield, CO 80021

2

EDS-105061 Rev E

Pin Description

Pin #

Function

Description

1

RF Input

Module RF input. This pin is internally connected to DC ground. Do not apply DC voltages to the RF leads. Care must be

taken to protect against video transients that may damage the active devices.

This is the drain voltage for the first stage. Nominally +28Vdc

maintain constant quiscent drain current over the operating temperature range. See Note 1.

4

RF Output

Module RF output. This pin is internally connected to DC ground. Do not apply DC voltages to the RF leads. Care must be

taken to protect against video transients that may damage the active devices.

Flange

Gnd

Exposed area on the bottom side of the package needs to be mechanically attached to the ground plane of the board for

optimum thermal and RF performance. See mounting instructions in application note AN-060 on Sirenza’s web site.

Simplified Device Schematic

Absolute Maximum Ratings

Parameters

Value

Unit

V

V

RF Input Power

+20

dBm

Load Impedance for Continuous Operation With-

out Damage

5:1

VSWR

Output Device Channel Temperature

+200

ºC

Operating Temperature Range

-20 to +90

ºC

Storage Temperature Range

-40 to +100

ºC

Operation of this device beyond any one of these limits may cause per-

manent damage. For reliable continuous operation see typical setup val-

ues specified in the table on page one.

Caution: ESD Sensitive

Appropriate precaution in handling, packaging

and testing devices must be observed.

Note 1:

The internally generated gate voltage is thermally compen-

sated to maintain constant quiescent current over the temper-

ature range listed in the data sheet. No compensation is

provided for gain changes with temperature. This can only be

accomplished with AGC external to the module.

Note 2:

Internal RF decoupling is included on all bias leads. No addi-

tional bypass elements are required, however some applica-

tions may require energy storage on the drain leads to

accommodate time-varying waveforms.

Note 3:

This module was designed to have its leads hand soldered to

an adjacent PCB. The maximum soldering iron tip tempera-

ture should not exceed 700° F, and the soldering iron tip

should not be in direct contact with the lead for longer than 10

seconds. Refer to app note AN060 (www.sirenza.com) for fur-

ther installation instructions.

Temperature

Compensation

Bias

Network

V

D2

D1

V

RF

1

Q1

Q2

2

3

4

Case Flange = Ground

in

out

RF

Quality Specifications

Parameter

Unit

Typical

ESD Rating

Human Body Model, JEDEC Document - JESD22-A114-B

V

8000

MTTF

Hours