Table 14.0

Package

Ceramic Surface Mount Package.

2111 Comprehensive Drive

Aurora, Illinois 60505

Phone: 630-851-4722

Fax: 630-851-5040

www.conwin.com

120°C

150°C

180°C

260°C

0

220°C

360 Sec. Max.

120 S

Max.

10 S

60 S

Max.

Time

Temperature

260°C

90%

50%

10%

200 mV/Div

0

Design Recommendations

1

Tape and Reel Specifications

OSC

TOP LAYER

GROUND LAYER

BOTTOM LAYER

Output

Buffer

50 Ohm Trace

Without

Vias

Model T504-019.44MHz

Typical Phase Noise

Solder Profile

LVCMOS Output Waveform

Clipped Sinewave Output Waveform

Package Characteristics

Environmental Characteristics

Table 15.0

Vibration:

Vibration per Mil Std 883E Method 2007.3 Test Condition A

Shock:

Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.

Soldering:

SMD product suitable for Convection Reflow soldering. Peak

temperature 260 C. Maximum time above 220 C, 60 seconds.

Solderability

Solderability per Mil Std 883E Method 2003

Suggested Pad Layout

Vcc, should have

a large copper

area for reduced

inductance.

Connect a 0.01uF

bypass capacitor

<0.1”(2.54mm)

from the pad.

Ground,

should have

a large copper

area for reduced

inductance.

0.010”(0.254mm)

Recommended

clearance

inductance

for internal

copper flood.

Top View

1

3

4

5

6

8

9

10

Buffer

Ground

50 Ohm trace

<1”by design

Vcc

Ground

Top View

0.215

(5.46mm)

0.037

(0.94mm)

0.051

(1.28mm)

0.051

(1.28mm)

0.295

(7.49mm)

0.030

(0.76mm)

Keep Out Area

Top View

1

Dimensional Tolerance:

±.005 (.127mm)

±.02 (.508mm)

Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation

US Headquarters:

630-851-4722

European Headquarters:

+353-61-472221

Bulletin

Page

Revision

Date

Tx176

4of4

07

25 Aug 2008