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TXB0104PWR Datasheet(PDF) 2 Page - Texas Instruments |
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TXB0104PWR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 25 page YZT PACKAGE (TOP VIEW) D C B A 3 2 1 TXB0104 SCES650D – APRIL 2006 – REVISED MAY 2008.............................................................................................................................................................. www.ti.com TERMINAL ASSIGNMENTS (YZT Package) 3 2 1 D A4 GND B4 C A3 OE B3 B A2 VCCA B2 A A1 VCCB B1 DESCRIPTION/ORDERING INFORMATION This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXB0104 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ — WCSP (DSBGA) 0.23-mm Large Bump – YZT Reel of 3000 TXB0104YZTR 2K7 (Pb-free) 0.625-mm max height UFBGA – GXU Reel of 2500 TXB0104GXUR YE04 UFBGA – ZXU (Pb-Free) Reel of 2500 TXB0104ZXUR YE04 TXB0104RGYR QFN – RGY Reel of 1000 YE04 TXB0104RGYRG4 –40 °C to 85°C TXB0104D Tube of 50 TXB0104DG4 SOIC – D TXB0104 TXB0104DR Reel of 2500 TXB0104DRG4 TXB0104PWR TSSOP – PW Reel of 2000 YE04 TXB0104PWRG4 (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) YZT: The actual top-side marking has three preceding characters to denote year, month, amd sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 2 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXB0104 |
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