21

5298A–SEEPR–1/08

AT24C32C/64C

15. Packaging Information

8Y6 - MLP

2325 Orchard Parkway

San Jose, CA 95131

TITLE

DRAWING NO.

R

REV.

8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,

Dual No Lead Package (DFN) ,(MLP 2x3)

D

8Y6

10/16/07

Notes:

1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,

tolerances, datums, etc.

2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the

terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.

3.

Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the

device through this pad, so if soldered it should be tied to ground

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

D

2.00 BSC

E

3.00 BSC

D2

1.40

1.50

1.60

E2

-

-

1.40

A

-

-

0.60

A1

0.0

0.02

0.05

A2

-

-

0.55

A3

0.20 REF

L

0.20

0.30

0.40

e

0.50 BSC

b

0.20

0.25

0.30

2

A2

A2

b

(8X)

(8X)

Pin 1 ID

Pin 1 ID

Pin 1

Pin 1

Index

Index

Area

Area

A1

A1

A3

A3

D

A

L (8X)

L (8X)

e (6X)

e (6X)

1.50 REF.

1.50 REF.

D2

D2