9 / 10 page
9 of 10
CXE-1089Z
Preliminary
EDS-105785 Rev D
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Application Schematic
Application Circuit Element Values
Evaluation Board Layout and Bill of Materials
Mounting Instructions
1. Solder the copper pad on the backside of the device package to the ground plane.
2. Use a large ground pad area with many plated through-holes as shown.
3. We recommend 1 or 2 ounce copper. Measurements for this data sheet were made on a 31mil thick GTEK board with 1
ounce copper on both sides.
Reference Designator
Frequency (MHz) 50 to 1200
F-connectors
C1, C3, C4
1000pF 0603 size
C2
100pF 0603 size
L1
1.2uH 1008LS size
*RBIAS
See table below
*Optional shunt resistor can be used to lower device current.
Performance degradation may occur.
RBIAS
Device Current (VD=5.0V)
1.3k
Ω
80mA
2.4k
Ω
90mA
4.7k
Ω
100mA
open
110mA
V+
C2
C1
L1
CXE-1089Z
C3
RF IN
*RBIAS
C4
RF OUT
75ohm 31mil SOT-89
125873
1.2uH
2uH
MicroDevices
Sirenza
Rbias
bi