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TDA8920CJ Datasheet(PDF) 8 Page - NXP Semiconductors |
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TDA8920CJ Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 40 page  TDA8920C_1 © NXP B.V. 2008. All rights reserved. Preliminary data sheet Rev. 01 — 29 September 2008 8 of 40 NXP Semiconductors TDA8920C 2 × 110 W class-D power amplifier 8.2 Pulse-width modulation frequency The output signal of the amplifier is a PWM signal with a carrier frequency typically between 300 kHz and 400 kHz. Using a 2nd-order LC demodulation filter in the application results in an analog audio signal across the loudspeaker. The carrier frequency is determined by an external resistor ROSC, connected between pin OSC and pin VSSA. An optimal setting for the carrier frequency is between 300 kHz and 400 kHz. The carrier frequency is set to 345 kHz by connecting a 30 k Ω external resistor between pin OSC and VSSA. See Table 8 for more details. If two or more class-D amplifiers are used in the same audio application, it is recommended that all devices use an external clock circuit to ensure that they operate at the same switching frequency. 8.3 Protection The following protection strategies are provided: • Thermal protection: – Thermal FoldBack (TFB) – OverTemperature Protection (OTP) • OverCurrent Protection (OCP, diagnostic output on pin PROT) • Window Protection (WP) • Supply voltage protection: – UnderVoltage Protection (UVP) – OverVoltage Protection (OVP) – UnBalance Protection (UBP) The device reacts to fault conditions differently for each protection type. 8.3.1 Thermal protection The TDA8920C has an advanced thermal protection strategy. It consists of a TFB function that gradually reduces the output power within a defined temperature range. If the temperature continues to rise, OTP is implemented, shutting down the device completely. 8.3.1.1 Thermal FoldBack (TFB) If the junction temperature (Tj) exceeds the defined threshold value, the gain is gradually reduced. This reduces the output signal amplitude and the power dissipation, eventually stabilizing the temperature. |
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