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OPA4872MDREP Datasheet(PDF) 3 Page - Texas Instruments |
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OPA4872MDREP Datasheet(HTML) 3 Page - Texas Instruments |
3 / 24 page ABSOLUTE MAXIMUM RATINGS (1) PIN CONFIGURATION 1 2 3 4 5 6 7 14 13 12 11 10 9 8 SD EN A1 IN0 GND IN2 V- IN1 IN3 V+ OUT FB A0 GND OPA4872 OPA4872-EP www.ti.com........................................................................................................................................................................................... SBOS444 – DECEMBER 2008 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PACKAGE-LEAD DESIGNATOR(2) RANGE MARKING NUMBER MEDIA, QUANTITY SO-14 D –55°C to 125°C OPA4872M OPA4872MDREP Tape and Reel, 2500 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Over operating free-air temperature range, unless otherwise noted. OPA4872 UNIT Power supply ±6.5 V Internal power dissipation See Thermal Characteristics Input voltage range ±VS V Storage temperature range –65 to +125 °C Lead temperature (soldering, 10s) +260 °C Junction temperature (TJ) +150 °C Junction temperature: continuous operation, long-term reliability +140 °C Human body model (HBM) 1500 V ESD rating Charged device model (CDM) 1000 V Machine model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. SO-14 Top View Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): OPA4872-EP |
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