74LVT273_3

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 — 10 September 2008

12 of 17

NXP Semiconductors

74LVT273

3.3 V octal D-type flip-flop

Fig 11. Package outline SOT339-1 (SSOP20)

UNIT

Q

(1)

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

7.4

7.0

5.4

5.2

0.65

7.9

7.6

0.9

0.7

0.9

0.5

8

0

o

o

0.13

1.25

0.2

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

1.03

0.63

SOT339-1

MO-150

99-12-27

03-02-19

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

110

20

11

y

0.25

pin 1 index

0

2.5

5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm

SOT339-1

A

max.

2