CY2305
CY2309
Document #: 38-07140 Rev. *I
Page 5 of 15
t6B
Delay, REF Rising Edge to
CLKOUT Rising Edge[6]
Measured at VDD/2. Measured in
PLL Bypass Mode, CY2309
device only.
15
8.7
ns
t7
Device to Device Skew[6]
Measured at VDD/2 on the
CLKOUT pins of devices
–
–
700
ps
tJ
Cycle to Cycle Jitter[6]
Measured at 66.67 MHz, loaded
outputs
–
70
200
ps
tLOCK
PLL Lock Time[6]
Stable power supply, valid clock
presented on REF pin
––
1.0
ms
Switching Characteristics for CY2305SC-1H and CY2309SC-1H Commercial Temperature
Devices
Parameter[7]
Name
Description
Min
Typ.
Max
Unit
t1
Output Frequency
30 pF load
10 pF load
10
10
–100
133.33
MHz
MHz
tDC
Duty Cycle[6] = t2 ÷ t1
Measured at 1.4V, Fout = 66.67 MHz
40.0
50.0
60.0
%
t3
Rise Time[6]
Measured between 0.8V and 2.0V
–
–
1.50
ns
t4
Fall Time[6]
Measured between 0.8V and 2.0V
–
–
1.50
ns
t5
Output to Output Skew[6]
All outputs equally loaded
–
85
250
ps
t6A
Delay, REF Rising Edge to
CLKOUT Rising Edge[6]
Measured at VDD/2
–
–
±350
ps
t6B
Delay, REF Rising Edge to
CLKOUT Rising Edge[6]
Measured at VDD/2. Measured in
PLL Bypass Mode, CY2309 device
only.
15
8.7
ns
t7
Device to Device Skew[6]
Measured at VDD/2 on the CLKOUT
pins of devices
––
700
ps
t8
Output Slew Rate[6]
Measured between 0.8V and 2.0V
using Test Circuit #2
1–
V/ns
tJ
Cycle to Cycle Jitter[6]
Measured at 66.67 MHz, loaded
outputs
–60
200
ps
tLOCK
PLL Lock Time[6]
Stable power supply, valid clock
presented on REF pin
––
1.0
ms
Operating Conditions for CY2305SI-XX and CY2309SI-XX Industrial Temperature Devices
Parameter
Description
Min
Max
Unit
VDD
Supply Voltage
3.0
3.6
V
TA
Operating Temperature (Ambient Temperature)
–40
85
°C
CL
Load Capacitance, below 100 MHz
–
30
pF
CL
Load Capacitance, from 100 MHz to 133 MHz
–
10
pF
CIN
Input Capacitance
–
7
pF
Switching Characteristics for CY2305SC-1 and CY2309SC-1 Commercial Temperature
Devices
Parameter[7]
Name
Test Conditions
Min
Typ.
Max
Unit
Note
7. All parameters specified with loaded outputs.
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