CY7C63801-SXC datasheet(5/83 Pages) CYPRESS

Part #	CY7C63801-SXC

Description	enCoRe??II Low-Speed USB Peripheral Controller

Download	83 Pages

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Manufacturer	CYPRESS [Cypress Semiconductor]

Direct Link	http://www.cypress.com

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5 / 83 page

CY7C63310, CY7C638xx

Document 38-08035 Rev. *J

Page 5 of 83

Figure 5-2. CY7C63823 Die Form

Die step = 1792.98 μm x 2272.998 μm

Die size = 1727 μm x 2187 μm

Bond pad opening = 70 μm x 70 μm

Die thickness = 14 mils

Legend

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Cypress Logo

X

Y

Table 5-1. Die Pad Summary

Pad Number

Pad Name

X (microns)

Y (microns)

1

P0.7

-742.730

911.990

2

P0.6

-755.060

792.200

3

P0.5

-755.060

699.300

4

P0.4

-755.060

606.400

5

P0.3

-755.060

-430.080

6

P0.2

-755.060

-522.980

7

P0.1

-755.060

-618.830

8

P0.0 CLKIN

-755.060

-714.020

9

P2.1

-755.060

-810.220

10

P2.0

-393.580

-977.930

11

VSS

537.500

-964.700

12

PI.0 D+

736.110

-936.680

13

P1.1 D–

736.110

-625.130

14

VDD

736.110

-260.670

15

P1.2 VREG

736.110

53.800

16

P1.3

723.510

336.780

17

P3.0

723.510

438.690

18

P3.1

723.510

532.880

19

P1.4

723.510

635.310

20

P1.5 SMOSI

723.510

728.220

21

P1.6 SMISO

723.510

839.290

22

P1.7

696.630

1008.480

23

Reserved

-795.400

1023.270

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