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MC8640TVU1000N Datasheet(PDF) 24 Page - Freescale Semiconductor, Inc |
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MC8640TVU1000N Datasheet(HTML) 24 Page - Freescale Semiconductor, Inc |
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24 / 140 page  MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 1 24 Freescale Semiconductor DDR and DDR2 SDRAM NOTE For the ADDR/CMD setup and hold specifications in Table 20, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied cycle. MDQS epilogue end tDDKHME –0.6 0.6 ns 6 Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time. 2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V. 3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. 4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the DQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same adjustment value. See the MPC8641 Integrated Processor Reference Manual for a description and understanding of the timing modifications enabled by use of these bits. 5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor. 6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows the symbol conventions described in note 1. 7. Maximum DDR1 frequency is 400 MHz 8. Per the JEDEC spec the DDR2 duty cycle at 400 and 533 MHz is the low and high cycle time values. Table 20. DDR SDRAM Output AC Timing Specifications (continued) At recommended operating conditions. Parameter Symbol 1 Min Max Unit Notes |
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