SFH615A/SFH6156

Document Number 83671

Rev. 2.0, 06-Sep-06

Vishay Semiconductors

www.vishay.com

3

Thermal Characteristics

The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the tem-

peratures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB,

layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's Thermal Characteristics

of Optocouplers Application note.

* For 2 layer FR4 board (4" x 3" x 0.062)

Parameter

Test condition

Symbol

Value

Unit

LED Power dissipation

at 25 °C

100

mW

Output Power dissipation

at 25 °C

150

mW

Maximum LED junction temperature

125

°C

Maximum output die junction temperature

125

°C

Thermal resistance, Junction Emitter to Board

θ

EB

173

°C/W

Thermal resistance, Junction Emitter to Case

θ

EC

149

°C/W

Thermal resistance, Junction Detector to Board

θ

DB

111

°C/W

Thermal resistance, Junction Detector to Case

θ

DC

127

°C/W

Thermal resistance, Junction Emitter to Junction Detector

θ

ED

95

°C/W

Thermal resistance, Board to Ambient*

θ

BA

195

°C/W

Thermal resistance, Case to Ambient*

θ

CA

3573

°C/W

T

A

θ

CA

T

C

T

JD

T

JE

T

B

θ

EC

θ

EB

θ

DC

θ

DB

θ

BA

θ

DE

T

A

19996

Package