Document Number: 94497

For technical questions, contact: diodes-tech@vishay.com

www.vishay.com

Revision: 02-Jul-08

1

Chip Scale Package Schottky Barrier Rectifier

FCSP230LTR

Vishay High Power Products

FEATURES

• Low leakage

• Low thermal resistance

• One-fifth footprint of SMA

• Super low profile (0.6 mm)

• Available tested on tape and reel

APPLICATIONS

• Reverse polarity protection

• Current steering

• Freewheeling

•Flyback

•Oring

DESCRIPTION

Vishay's

product

family

utilizes

wafer

level

chip scale packaging to deliver Schottky diodes with the

bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and

cathode connections are made through solder bump pads on

one side of the silicon enabling designers to strategically

place the diodes on the PCB. This design not only minimizes

board space but also reduces thermal resistance and

inductance, which can improve overall circuit efficiency.

Typical applications include hand-held, portable equipment

such as cell phones, MP3 players, bluetooth, GPS, PDAs,

and portable hard disk drives where space savings and

performance are crucial.

PRODUCT SUMMARY

1.5 A

30 V

RoHS

COMPLIANT

MAJOR RATINGS AND CHARACTERISTICS

SYMBOL

CHARACTERISTICS

MAX.

UNITS

30

V

Rectangular waveform

1.5

A

250

0.37

V

- 55 to 150

°C

VOLTAGE RATINGS

PARAMETER

SYMBOL

FCSP230LTR

UNITS

Maximum DC reverse voltage

30

V

Maximum working peak reverse voltage